Enermax Thermal Paste 3.0g

Enermax ETC521 thermal compound features high thermal conductivity, no electrical conductivity and no corrosive property. Easily apply it on your CPU to transfer more heat from your CPU to the base plate of the heat sink you installed. It comes in a small resealable syringe and once applied, it can be used for years. I
Enermax ETC521 thermal compound features high thermal conductivity, no electrical conductivity and no corrosive property. Easily apply it on your CPU to transfer more heat from your CPU to the base plate of the heat sink you installed. It comes in a small resealable syringe and once applied, it can be used for years. It is the go-to choice for gamers and overclockers. Optimized polymer matrix to help reduce pump out Flowable Good thermal conductivity Low thermal resistance Non-curing, no need for curing ovens Heat removal from electronics components Can achieve thin Bond Line Thickness (BLT)

Enermax ETC521 Thermal Compound 3.0g

Computer Thermal Paste

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Enermax ETC521 Thermal Compound 3.0g

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Enermax Thermal Paste 3.0g